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Board 3s SKYPERTM 32PRO - Technical Explanations
Evaluation Board 3s SKYPERTM 32PRO
Technical Explanations
Revision 02 Status: evaluation board
-------------------------------------------------------------------------------------------------------------------------------------------------------------------------This Technical Explanation is valid for the following parts: part number L6100250 Related documents: title Technical Explanations SKYPERTM 32PRO Prepared by: Markus Hermwille -------------------------------------------------------------------------------------------------------------------------------------------------------------------------version Rev02 type Board 3s SKYPERTM 32PRO date code (YYWW) 0522
Content Disclaimer................................................................................................................................................................ 2 Application and Handling Instructions...................................................................................................................... 3 Further application support...................................................................................................................................... 3 General Description................................................................................................................................................. 3 Dimensions.............................................................................................................................................................. 4 Component Placement Layout ................................................................................................................................ 4 PIN Array (not SKiiP(R) compatible) .......................................................................................................................... 5 Signal IF_CMN_nHALT ........................................................................................................................................... 6 Setting Dead Time................................................................................................................................................... 6 Setting Dynamic Short Circuit Protection................................................................................................................. 6 Collector Series Resistance..................................................................................................................................... 7 Adaptation Gate Resistors....................................................................................................................................... 7 Setting Soft Turn-Off................................................................................................................................................ 7 Temperature Signal ................................................................................................................................................. 7 Over Temperature Protection Circuit (OTP) ............................................................................................................ 8 Mounting Notes ....................................................................................................................................................... 8 Schematics .............................................................................................................................................................. 9 Layouts.................................................................................................................................................................. 11 Parts List ............................................................................................................................................................... 12
Information furnished in this document is believed to be accurate and reliable. However, no representation or warranty is given and no liability is assumed with respect to the accuracy or use of such information. Furthermore, this technical information specifies semiconductor devices but promises no characteristics. No warranty or guarantee expressed or implied is made regarding delivery, performance or suitability. Specifications mentioned in this document are subject to change without notice. This document supersedes and replaces all information previously supplied and may be supersede by updates.
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Board 3s SKYPERTM 32PRO - Technical Explanations
Disclaimer In accordance with SEMIKRON's quality procedures, we hereby notify you that the Evaluation Board 3s SKYPERTM 32PRO should be considered as evaluation products only. Evaluation products are experimental products and are therefore only intended for device evaluation. SEMIKRON does not represent or guarantee that a final version will be made available after device evaluation. Evaluation products are subject to the change service. Although evaluation products have been manufactured using processes and procedures representative of final production, they have not been subjected to all of our normal quality audits and controls. Additionally, neither the product nor the manufacturing processes may have passed our internal qualification procedures. IMPORTANT: The evaluation boards are supplied without warranty of any kind, expressed, implied of statutory, including but not limited to, any implied warranty of merchantability of fitness for a particular purpose. Credit or replacement for evaluation products that fail to function will not be given nor will a failure analysis be performed. There is no entitlement to technical support for evaluation products. Claims for damages and reimbursement of expenses on the part of the undersigned customer shall be excluded, regardless of the legal cause, especially claims in contract and in tort. The liability exclusions shall not apply in cases of liability independent of the question of blame or negligence, especially claims under the German Product Liability Act in cases of wilful intent, gross negligence, or injury to life, limb or health and on account of a breach of major contractual obligations. Compensation for failure to comply with major contractual obligations shall be limited, however, to typical, foreseeable damages, unless wilful intent or gross negligence applies, or on account of liability for injury to life, limb or health. Any change in the burden of proof to the detriment of the undersigned customer shall not be associated with the aforesaid rulings FOR SAFETY REASONS THE CUSTOMER IS NOT ALLOWED TO SELL EVALUATION PRODUCTS TO ANY END CUSTOMER OR ANY OTHER THIRD PARTY. If the customer fails not to sell the evaluation products to any end customer or any other third party, then the customer shall indemnify SEMIKRON against all claims by the concerned end customer or third party in respect of any loss, damage or injury arising from the aforesaid reason.
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Board 3s SKYPERTM 32PRO - Technical Explanations
Please note: All values in this technical explanation are typical values. Typical values are the average values expected in large quantities and are provided for information purposes only. These values can and do vary in different applications. All operating parameters should be validated by user's technical experts for each application.
Application and Handling Instructions Please provide for static discharge protection during handling. As long as the hybrid driver is not completely assembled, the input terminals have to be short-circuited. Persons working with devices have to wear a grounded bracelet. Any synthetic floor coverings must not be statically chargeable. Even during transportation the input terminals have to be short-circuited using, for example, conductive rubber. Worktables have to be grounded. The same safety requirements apply to MOSFET- and IGBT-modules. Any parasitic inductances within the DC-link have to be minimised. Over-voltages may be absorbed by C- or RCD-snubber networks between main terminals for PLUS and MINUS of the power module. When first operating a newly developed circuit, SEMIKRON recommends to apply low collector voltage and load current in the beginning and to increase these values gradually, observing the turn-off behaviour of the free-wheeling diode and the turn-off voltage spikes generated across the IGBT. An oscillographic control will be necessary. Additionally, the case temperature of the module has to be monitored. When the circuit works correctly under rated operation conditions, short-circuit testing may be done, starting again with low collector voltage. It is important to feed any errors back to the control circuit and to switch off the device immediately in failure events. Repeated turn-on of the IGBT into a short circuit with a high frequency may destroy the device. The inputs of the hybrid driver are sensitive to over-voltage. Voltages higher than VS +0,3V or below -0,3V may destroy these inputs. Therefore, control signal over-voltages exceeding the above values have to be avoided. The connecting leads between hybrid driver and the power module should be as short as possible (max. 20cm), the driver leads should be twisted.
Further application support Latest information is available at http://www.semikron.com. For design support please read the SEMIKRON Application Manual Power Modules available at http://www.semikron.com.
General Description The Board 3s SKYPERTM 32PRO is an evaluation board for the IGBT module SEMiX 3s (spring contact version). (R) The board can be customized allowing adaptation and optimization to the used SEMiX Module. The switching characteristic of the IGBT can be influenced through user settings, e.g. changing turn-on and turnoff speed by variation of RGon and RGoff. Furthermore, it is possible to adjust the monitoring level and blanking time for the DSCP, soft turn-off behaviour as well as an over temperature trip level by using the temperature sensor (R) integrated in SEMiX modules (see Technical Explanations SKYPERTM 32PRO).
Please note: This technical explanation is based on the Technical Explanations for SKYPERTM 32PRO. Please read the Technical Explanations SKYPERTM 32PRO before using the Evaluation Board.
(R)
Board 3s SKYPERTM 32PRO
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Board 3s SKYPERTM 32PRO - Technical Explanations
Dimensions
Dimensions in mm
16,74 2,8 40,38 O3
O 3,2
O 3,2 O3
O 1,3 97,3 2,54 100
Component Placement Layout
Evaluation Board
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Board 3s SKYPERTM 32PRO - Technical Explanations
PIN Array (not SKiiP(R) compatible)
Connector X20 (ODU FLAKAFIX 511.068.803.020) Product information of suitable female connectors and distributor contact information is available at e.g. http://www.harting.com (part number 09 18 520 6 813).
PIN X20:01 X20:02 X20:03 X20:04 X20:05 X20:06 X20:07 X20:08 X20:09 X20:10 X20:11 X20:12 X20:13 X20:14 X20:15
Signal IF_PWR_15P IF_PWR_GND IF_PWR_15P IF_PWR_GND IF_PWR_15P IF_PWR_GND reserved IF_PWR_GND IF_CMN_nHALT reserved reserved IF_CMN_GND reserved reserved IF_HB_TOP
Function Drive power supply GND for power supply Drive power supply GND for power supply Drive power supply GND for power supply
Specification Stabilised +15V 4%
Stabilised +15V 4%
Stabilised +15V 4%
GND for power supply Driver core status signal (bidirectional signal with dominant recessive behaviour) Digital 15V logic; LOW (dominant) = driver disabled; HIGH (recessive) = ready to operate
GND for signal IF_CMN_nHALT
Switching signal input (TOP switch)
Digital 15 V logic; 10 kOhm impedance; LOW = TOP switch off; HIGH = TOP switch on Digital 15 V logic; 10 kOhm impedance; LOW = BOT switch off; HIGH = BOT switch on
X20:16 X20:17 X20:18 X20:19 X20:20
IF_HB_BOT reserved IF_HB_GND reserved reserved
Switching signal input (BOTTOM switch)
GND for signals IF_HB_TOP & IF_HB_BOT
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Signal IF_CMN_nHALT The Halt Logic Signals PRIM_HALT_IN and PRIM_HALT_OUT of the driver core are coupled to one bidirectional signal (IF_CMN_nHALT) with dominant recessive behaviour. IF_CMN_nHALT shows the driver core status. When IF_CMN_nHALT is HIGH (recessive), the driver core is ready to operate. When IF_CMN_nHALT is LOW (dominant), the driver core is disabled / not ready to operate because of e. g. detected failure or driver core system start. A controller can hold with the IF_CMN_nHALT signal the driver core in a safe state (e.g. during a start up of a system or gathered failure signal of other hardware) or generate a coeval release of paralleled driver. Furthermore, paralleled drivers can send and receive IF_CMN_nHALT signals among each other by using a single-wire bus.
Connection IF_CMN_nHALT
Setting Dead Time
DT adjustment
Designation R43 (connected to GND) R44 (connected to GND) R45 (connected to GND) R46 (connected to GND) Factory setting: 4s
Pattern Name 0603 0603 0603 0603
Setting PRIM_CFG_TDT2_IN Factory setting: 0 PRIM_CFG_SELECT_IN Factory setting: not equipped PRIM_CFG_TDT3_IN Factory setting: 0 PRIM_CFG_TDT1_IN Factory setting: not equipped
Setting Dynamic Short Circuit Protection
RCE & CCE
Designation R162 C150 R262 C250
Pattern Name 1206 1206 1206 1206
Setting RCE Factory setting: not equipped CCE Factory setting: not equipped RCE Factory setting: not equipped CCE Factory setting: not equipped TOP TOP BOT BOT
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Collector Series Resistance
RVCE
Designation R150 R250
Pattern Name MiniMELF MiniMELF
Setting RVCE * Factory setting: not equipped RVCE * Factory setting: not equipped TOP BOT
* 1200V IGBT operation: 0 * 1700V IGBT operation: 1k / 0,4W
Adaptation Gate Resistors
RGon & RGoff
Designation R151, R152, R153 (parallel connected) R154, R155, R156 (parallel connected) R251, R252, R253 (parallel connected) R254, R255, R256 (parallel connected)
Pattern Name MiniMELF MiniMELF MiniMELF MiniMELF
Setting RGon Factory setting: not equipped RGoff Factory setting: not equipped RGon Factory setting: not equipped RGoff Factory setting: not equipped TOP TOP BOT BOT
Setting Soft Turn-Off
RGoff_SC
Designation R160, R161 (parallel connected) R260, R261 (parallel connected)
Pattern Name MiniMELF MiniMELF
Setting RGoff_SC Factory setting: not equipped RGoff_SC Factory setting: not equipped TOP BOT
Temperature Signal The temperature sensor inside the SEMiX module is directly connected to contacting points T1 and T2. For (R) details to the temperature sensor, see Modules Explanations SEMiX .
Safety Warnings: The contacting points T1 and T2 are not electrical isolated. Due to high voltage that may be present at the contacting points T1 and T2, some care must be taken in order to avoid accident. There is no cover or potential isolation that protect the high voltage sections / wires from accidental human contact.
(R)
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Please note: If the contacting points T1 and T2 are used for evaluation of the temperature sensor, the Over Temperature Protection Ciruit must be disabled by taking out the resistors R175, R178 and R179.
Over Temperature Protection Circuit (OTP) The external error input SEC_TOP_ERR_IN on the secondary side (high potential) of the driver core is used for an over temperature protection circuit to place the gate driver into halt mode.
Dimensioning OTP 1. Define an over temperature trip level according to the application. 2. Calculate the nominal ohmic resistance value of the temperature sensor at the defined trip level (see "Modules - Explanations - SEMiX(R)" on SEMiX(R) product overview page at http://www.semikron.com). 3. The trip level on the adapter board is set with R172 by using the calculated resistance value.
Factory setting R172: not equipped If no resistor is used, a failure signal is generated.
Mounting Notes The electrical connections between evaluation board and SEMiX are realised via spring contacts integrated in (R) SEMiX power modules and via landing pads on the bottom side of the evaluation board.
Evaluation Board & Driver Core Mounting 1. Soldering of components (e.g. RGon, RGoff, etc.) on adapter board. 2. Evaluation Board has to be fixed to the SEMiX(R) module (see "Mounting Instruction and Application Notes for SEMiX(R) IGBT modules" on SEMiX(R) product overview page at http://www.semikron.com). 3. Insert driver core into the box connector on evaluation board.
(R)
The connection between driver core and evaluation board should be mechanical reinforced by using support posts. The posts have to be spaced between driver core and evaluation board. Product information of suitable support posts and distributor contact information is available at e.g. http://www.richcoinc.com (part number MSPM-8-01).
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Schematics
Schematic I Evaluation Board
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Schematic II Evaluation Board
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Layouts
Primary & Secondary Layer
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Parts List
Parts List Evaluation Board
Count 7 6 1 1 1 2 1 1 1 2 1 2 1 2 3 1 1 6 3 5 1 1 2 3 1 1 1 1 2 1 2 2 1 5 1 1 4 Ref. Designator C170, C171, C173, C174, C175, C176, CN170 C20, C21, C22, C23, C24, C25 C26 C27 C31 C35, C151 C36 CD20 D20 L150, L151 N170 R157, R171 R158 R163, R263 R170, R174, R176 R175 R177 R24, R25, R26, R27, R178, R179 R28, R50, R52 R30, R31, R32, R34, R37 R33 R36 R43, R45 R47, R54, R56 R51 R53 R57 R58 R60, R61 R62 V150, V250 V170, V171 V20 V23, V25, V26, V27, V29 V28 X20 X6, X7, X10, X11 Value 100nF 1nF 2,2F 220uF/35V 68pF 1uF 100pF 100nF 74C14 100uH LM2904 15,0KOhm 10,0Ohm 10,0KOhm 30,1KOhm 5,62KOhm 3,01KOhm 0,00Ohm 10,0KOhm 5,11KOhm 5,11KOhm 3,32KOhm 0,00Ohm 10,0KOhm 121KOhm 100Ohm 1,50KOhm 1,00KOhm 2,00KOhm 3,92KOhm BY203/20S BAV70W SMCJ15 BC847B BZX284-C7V5 20p. RM2,54 10p. Pattern Name 0805 (SMD) 0805 (SMD) 1210 (SMD) SMD 0603 (SMD) 1206 (SMD) 0603 (SMD) 1206 (SMD) SOIC 14 (SMD) SIMID02 (SMD) SOIC 8 (SMD) 0603 (SMD) 0603 (SMD) MiniMelf (SMD) 0603 (SMD) MiniMelf (SMD) 1206 (SMD) MiniMelf (SMD) MikroMelf (SMD) MikroMelf (SMD) MiniMelf (SMD) 0603 (SMD) 0603 (SMD) 0603 (SMD) 0603 (SMD) MikroMelf (SMD) MikroMelf (SMD) 0603 (SMD) 0603 (SMD) 0603 (SMD) SOT323 (SMD) DO214AB (SMD) SOT23 (SMD) SOD110 (SMD) SMD SMD Description Capacitor X7R Capacitor X7R Capacitor X7R Longlife-Elko Capacitor NP0 Capacitor X7R Capacitor NP0 CapacitorX7R Logic-IC 74C... Inductor Operational Amplifier 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% High Voltage Diode Double Diode Suppressor Diode NPN-Transistor Zener-Diode Connector Box Connector
TP: Test Point Box Connector: SUYIN 254100FA010G200ZU
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